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The functional part of the solder paste includes: a matrix, a remover and a surfactant.

The matrix is the main component of the solder paste, which controls the melting point of the flux. It melts to cover the surface of the solder joint and acts as a barrier to air. At the same time, it is a solvent for other functional components.
The film removing agent removes, crushes or loosens the surface oxide film of the base material by a physicochemical process, so that the molten solder can wet the surface of the fresh base material.
The surfactant can further reduce the interfacial tension between the molten solder and the base metal, and promote the better spreading of the molten solder on the surface of the base material.
(1) The oxides on the surface of the base metal and the liquid solder are removed during the brazing process to create conditions for the spreading of the liquid solder.
(2) Covering the surface of the base metal and the solder with a thin layer of liquid to protect the air.
(3) It acts as an interface to improve the wetting and spreading properties of the liquid solder on the surface of the base metal.