Welcome to our website!

Contact Us

Contact:Mr.Lin
Tel:+86-574-88396586
Fax:+86-574-88396587
Add:No. 207, Baiduxiacai Village, Xiwu Street, Fenghua District, Ningbo City, Zhejiang Province

Your Position:Home >News Center

The future development of solder paste

In recent years, with the development of the domestic electronics industry, the demand for electronic accessories has become higher and higher. Take the solder paste, from the rosin in the early years to the flux, and now slowly take the lead. Solder paste. Solder paste is currently being reworked in BGA, mobile phone PCB repair and electronic maintenance.
So what exactly is the solder paste used for? There are three main uses:
1. Remove surface oxides;
2. Isolate the air in a liquid state to prevent oxidation;
3. Active action to improve the wetting and spreading properties of the surface of the base metal.
In general, it is a role of soldering, which makes the soldering of components more convenient and more secure.
In terms of use, previous rosins and fluxes can remove surface oxides and prevent oxidation, but if you want to have good activity, you should use more advanced solder paste. The raw materials and processes of solder paste are much better.
Solder paste is generally used for electronic production and maintenance. The production of electronic products usually takes environmental protection into consideration. Therefore, in the future development of solder paste, it is necessary not only to develop high-performance solder paste, but also to protect the environment. The weight, so the future development of solder paste is bound to be - halogen-free lead-free solder paste, to achieve zero halogen halogen paste.